FEHONDA LTP81 Thermal Putty 18W/m.K 50g/100g High Thermal Conductive Gel for CPU GPU Heat Dissipation Putty for PS4 PS5 Cooling

Why Choose FEHONDA LTP81? It Solves Your Heat Troubles Directly!

All LTP81 thermal putty undergoes strict quality testing to ensure consistent performance, durability, and compatibility with electronic components—your reliable choice for heat management.18W/m.K high thermal conductivity: solves the “high power” problem of CPU/GPU, slow heat dissipation, and “LED driver overheating” problem – absorbs heat 50% faster than ordinary thermal grease, maintaining the stability of high-performance components (such as gaming GPU, server CPU).

FEHONDA LTP81 Thermal Putty Advantages

✅ 18W/m.K High Thermal Conductivity: Rapidly dissipates heat, keeping high-heat components cool and stable.
✅ Non-Curing & Flowable: Flows under pressure (like thermal grease) and never cures—maintains reliability through repeated thermal cycles.
✅ Superior Gap Filling: Seals uneven surfaces fully, eliminating air pockets that reduce heat transfer efficiency.
✅ Excellent Performance: Boasts high electrical insulation, wide temperature resistance (-40°C~180°C), and low stress on components.
✅ Automation Ready: Supports automatic dispensing, ideal for mass production to save time and labor.

FEHONDA LTP81 Thermal Putty Wide Applications

Perfect for thermal conductivity, gap filling, and insulation between power devices, enclosures, and heat sinks. Widely used in:
Optoelectronics industry
Consumer electronics (laptops, smartphones)
Communication power supplies & equipment
Network terminals